Home > News > Industry News > Wire Saw Cutting Processing Technology for Hard and Brittle Materials
Hard and brittle materials include monocrystalline, hard alloys, ceramics, rare-earth magnetic materials, etc. These materials are mostly non-conductive or semiconductive, typically characterized by high hardness, brittleness, wear resistance, corrosion resistance, oxidation resistance, high electrical resistance, high temperature resistance, non-magnetic properties, among others. Due to their excellent properties that are often unmatched by metallic materials, the applications of hard and brittle materials have expanded from industries like construction and handicraft manufacturing to aerospace, machinery, automotive, light industry, chemical industry, etc. (such as using agate, gemstones to make bearings; using engineering ceramics to manufacture cutting tools). The widespread application of hard and brittle materials poses higher demands on their processing technology.
Its main process requirements include: high efficiency, low cost, narrow kerf (high material utilization), no damage, and no environmental pollution. Due to the characteristics of hard and brittle materials, the available cutting methods are fewer compared to metal cutting. Commonly used cutting methods include diamond saw blade cutting (including diamond frame saws, diamond wire saws, etc.), laser beam cutting, and high-pressure water jet cutting.
These cutting methods each have their advantages and limitations. For instance, diamond saw blade cutting generally cannot cut curves, and it results in wider kerfs and lower material utilization rates, making it unsuitable for precise cutting of valuable materials. Laser beam cutting has a wide range of applications but is limited in cutting depth; the use of high-power lasers can significantly reduce processing efficiency due to the high-temperature plasma generated between the laser and the workpiece, increasing the difficulty of ejecting molten material and requiring expensive equipment investments. High-pressure water jet cutting can cut brittle non-metallic materials like stone and ceramics, but it leads to wider kerfs, making fine cutting challenging. Additionally, the equipment is expensive and consumes a significant amount of water resources during cutting.
In the past decade, with the rapid development of superhard materials and their application technologies, new processes and equipment for cutting hard and brittle materials have emerged continuously. Among them, the diamond cutting wire loop technology has developed rapidly. The unique structure of the diamond cutting wire loop not only allows it to cut various valuable hard and brittle materials but also facilitates cutting curves.
After reviewing the information above, if you have any further questions regarding cutting processes, please contact us at https://www.ensolltoolstec.com/.
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