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ESG250-4T

Description :

The ESG250-4T diamond wire saw cutting machine is equipped with two wheels and can cut monocrystalline silicon with a chipping amount of ≤5mm. It offers multiple adjustable speeds to meet your diverse cutting needs.

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Features :

1. The Exclusive Intelligent Digital TestingPlatform ensures the optimal cutting plan

2. Solves the industry problem of chipping, enhancing cutting quality by 20%

3. Worry-free handling for loading and unloading; eliminates potential safety hazards for operators

4. Save 60% of cutting time using unidirectional cutting method, resultingin faster linear speedand higher cutting efficiency.

5. Continuous operation of the equipment is worry-free, increasing productivity by 30%.

Technical Parameters :

Power	2400w
Machine size	1900mm×1420mm×2080mm(LxWxH)
Water tank size	1400x800×350mm (180L)
Max cutting size	1500x210×210mm (LxWxH)
Displacement servo motor Z/Y power	1000w
Water pump	220w3OL/min
Machine weight	1250KG
Feed speed	0.1-1000 mm/min
Line speed	1-32m/s
Mator speed	30OORMP
Loading capacity	300KG
Drive wheel diameter	280mm
Driven wheel diameter	260mm
Wire diameter	0.45-0.65mm
Cutting height	0.1-250 mm

Application areas :

In addition to the aforementioned areas, we can also cut many other materials and provide free trial cutting services and one-stop ODM services. If you have any technical questions, we can provide free technical consultation. Please feel free to contact us!

Silicon cutting
Optical glass cutting
Graphite/Corrugated paper
Ceramic/Target cutting
Crystal Cutting
Metal cutting

HOW to choose the right model of the machine?

1.The hardness of your material and the size of the materials before cutting.

2.The cutting method which is best for your material.

3.If any special request for cutting.

Cutting video：

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