Home > Product > Diamond Wire Cutting Machine > Gantry cutting > ESD150-3T
1.High-Precision Cutting
The cutting precision reaches ±0.05mm, with a surface roughness as low as Ra 0.5μm, meeting the demands of high-precision processing.
Suitable for cutting ultra-thin materials, with a minimum cutting thickness of 0.1mm.
2.Multi-Functional Applicability
Capable of cutting various hard and brittle materials, including silicon wafers, sapphire, ceramics, glass, stone, composite materials, and more.
Wide cutting thickness range, from 0.1mm to 50mm, catering to different material requirements.
3.High-Efficiency Cutting Speed
The cutting speed can reach up to 20mm²/min, significantly improving experimental and production efficiency.
Automated cutting mode reduces manual intervention and enhances consistency.
4.Compact Desktop Design
The equipment features a small footprint, occupying only 0.5㎡, making it ideal for laboratories and small workshops.
The user-friendly interface supports one-click operation, ensuring ease of use.
5.Low Consumable Costs
The diamond wire has a long service life, with a single wire capable of cutting over 1000 meters of material, reducing consumable costs.
The equipment is easy to maintain and has low operating costs.
Equipment size: | 650mm*750mm*980mm(L*W*H) |
Equipment weight: | 230Kg |
Workbench size: | 150*150mm |
Feed speed: | 0.1-10mm/min |
Cutting line speed: | 0-35m/s |
Cutting stroke: | 150*150mm (Y axis*Z axis) |
Maximum cutting size: | 150*150*150mm(L*W*H) |
Drive mode: | same service |
Working voltage: | 220V |
Workbench load: | 10Kg |
Total power: | 1.8KW (estimated) |
Wire length: | 1470±5mm (tentative, final wire length confirmed after trial cutting) |
Wire wheel: | two 180mm, one 230mm (single slot) |
Wire diameter: | 0.35mm |
In addition to the aforementioned areas, we can also cut many other materials and provide free trial cutting services and one-stop ODM services. If you have any technical questions, we can provide free technical consultation. Please feel free to contact us!
Silicon cutting
Optical glass cutting
Graphite/Corrugated paper
Ceramic/Target cutting
Crystal Cutting
Metal cutting
1.The hardness of your material and the size of the materials before cutting.
2.The cutting method which is best for your material.
3.If any special request for cutting.
If you have any question, Please contact us
If you have any question, please contact us